1/8 www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. stepping motor driver series standard 36v stepping motor drivers BD63801EFV description BD63801EFV is rated 24v system maximum input voltage / 0. 8a maximum output current and employs a constant-current pwm control scheme for low power consumption. serial (clk-in) drive mode allows for simple interfacing a nd operation, while allowing for full and half excitation modes. the single-power supply configuration allows for easy design and layout in the application. feature 1) power supply: one system drive (19v 28v) 2) low on resistance dmos output 3) serial (clk-in) drive mode 4) pwm constant current control (self oscillation) 5) built-in spike noise cancel function (external noise filter is unnecessary) 6) full step applicable to half step 7) normal / reverse rotation switching function 8) power save function* 9) built-in logic input pull-down resistor 10) power-on reset function 11) thermal shutdown circuit (tsd) 12) over current protection circuit (ocp) 13) under voltage lock out circuit (uvlo) 14) over voltage lock out circuit (ovlo) 15) malfunction prevention at the time of no app lied power supply (ghost supply prevention) 16) electrostatic discharge: 4kv (hbm specification) 17) microminiature, ultra-slim and high h eat-radiation (exposed metal type) htssop package 18) function pin compatible with constant current 2ch 36v simple stepping motor driver series application ppc, laser beam printer, scanner, photo printer, fax, ink jet printer, mini printer, sewing machine, toy, and robot etc. no.12009eat07
technical note 2/8 BD63801EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. absolute maximum ratings(ta=25 ) item symbol BD63801EFV unit supply voltage v cc1,2 -0.2 +36.0 v power dissipation pd 1.1 1 w 4.0 2 input voltage for control pin v in -0.2 +5.5 v rnf maximum voltage v rnf 0.5 v maximum output current i out 0.8 3 a/phase operating temperature range t opr -25 +85 storage temperature range t stg -55 +150 junction temperature t jmax +150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 8.8mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 32.0mw/ for operating above ta=25 . 3 do not, however exceed pd, aso and tjmax=150 . operating conditions(ta= -25 +85 ) item symbol BD63801EFV unit supply voltage v cc1,2 19 28 v output current (dc) i out 0.5 4 a/phase 4 do not however exceed pd, aso. electrical characteristics applicable to all the series (unless otherwise specified ta=25 , v cc1,2 =24v) item symbol limit unit condition min. typ. max. whole circuit current at standby i ccst - 0.6 2.0 ma ps=l circuit current i cc - 2.7 7.0 ma ps=h, vref=0.4v control input (clk, fr, mode, en, ps) h level input voltage v inh 2.0 - - v l level input voltage v inl - - 0.8 v h level input current i inh - 33 50 a v in =3.3v output (out1a, out1b, out2a, out2b) output on resistance r on - 2.8 3.6 i out =0.3a sum of upper and lower output leak current i leak - - 10 a current control rnfx input current i rnfx -40 -20 - a rnfx=0v vrefx input current i vref -2.0 -0.1 - a vrefx=0v vrefx input voltage range v ref 0 - 0.4 v comparator offset v cofs -20 0 20 mv vrefx=0.4v minimum on time t onmin 0.3 0.7 1.2 s r=39k , c=1000pf
technical note 3/8 BD63801EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. terminal function ? block diagram ? application circuit diagram pin no. pin name function pin no. pin name function 1 pgnd ground terminal 13 clk clock input terminal (for advancing electrical angle) 2 en output enable terminal 14 pgnd ground terminal 3 vref2 output current value setting terminal 15 vcc1 power supply terminal 4 cr2 connection terminal of cr for setting pwm frequency 16 out1a h bridge output terminal 5 nc non connection 17 rnf1 connection terminal of resistor for output current detection 6 test terminal for testing (used by connecting with gnd) 18 out1b h bridge output terminal 7 gnd ground terminal 19 out2b h bridge output terminal 8 ps power save terminal 20 rnf2 connection terminal of resistor for output current detection 9 cr1 connection terminal of cr for setting pwm frequency 21 out2a h bridge output terminal 10 vref1 output current value setting terminal 22 vcc2 power supply terminal 11 mode motor excitation mode setting terminal 23 nc non connection 12 nc non connection 24 fr motor rotating direction setting terminal fig.1 block diagram & application circuit diagram out1b out2a out2b 0.3 fr cl k 24 13 vref1 10 en mode 2 11 7 gnd 14 pgnd tsd ovlo uvlo 6 test regulator reset 1 pgnd 8ps predriver current limit comp. 15 vcc1 18 one shot 16 out1a 17 rnf1 logic 9 cr1 ocp predriver current limit comp. 22 vcc2 19 one shot 21 20 rnf2 logic 4 cr2 ocp trigger trans- lator vref2 3 39k 1000pf set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k 39 k 1000pf set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k terminal for testing. please connect to gnd. bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) resistor for current detection. setting range is 0.2 ? 0.9 0.3 be sure to short vcc1 & vcc2 0.1uf resistor for current detection. setting range is 0.2 ? 0.9 100uf
technical note 4/8 BD63801EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. points to noti ce for terminal description clk(pin13) clock input terminal for advancing the electrical angle clk is reflected at rising edge. the electrical angle advances by one for each clk input. motor?s misstep will occur if noise is picked up at the clk terminal, so please design the pattern in such a way that there is no noise plunging. mode(pin11) motor excitation mo de setting terminal set the motor excitation mode. mode excitation mode l full step h half step a fr(pin24) motor rotating direction setting terminal set the motor?s rotating direction. change in setting is reflec ted at the clk?s rising edge immediately after the change in setting cw_ccw rotating direction l clockwise (ch2?s current is outputted with a phase lag of 90 in regard to ch1?s current) h counter clockwise(ch2?s current is outputted with a phase lead of 90 in regard to ch1?s current) enable(pin2) output enable terminal turn off forcibly all the output transistors (motor output is open). at the time of enable=l, electrical angle or oper ating mode is maintained even if clk is inputted. please be careful because the electrical angle at the time of enable being released (enable=l h) is different from the released occasion at the section of clk=h and fr om the released occasion at the section of clk l . enable motor output l open (electrical angle maintained) h active ps(pin8) power save terminal ps can make circuit standby state and make motor output open. in standby state, translator circuit is reset (initialized) and electrical angle is initialized. please be careful because there is a delay of 40 s(max.) before it is returned from standby state to normal state and the motor output becomes active. ps state l standby state (reset) h active the electrical angle (initial electrical angle) of each excita tion mode immediately after reset is as follows please be careful because the initial state at the time of full step is different from half step. excitation mode initial electrical angle full step 45 halfstep a 0 protection circuits thermal shutdown (tsd) this ic features an integrat ed thermal shutdown for protection against t hermal destruction. when the ic?s chip temperature rises above 175c (typ.), the motor output is forced open. when the temperature returns to 150c or less (typ.), the ic automatically resu mes normal operation. however, even if tsd has engaged, the ic may become damaged if heat continues to be abs orbed from an external source. over-current protection (ocp) this ic features an integrated over-cu rrent protection circuit to protect agai nst destruction if the motor outputs are shorted to one another, if vcc is shorted to the motor output, or if the moto r output is shorted to gnd. the circuit latches the motor output open if current flows above the maximum threshold for 4 s (typ.), and is disengaged when the ic is power-cycled or if the ps terminal is reset. the oc p circuitry is designed only to protect the ic from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. therefore, applications should not be designed under the assumption that this circuitry will engage. after ocp has engaged, if irregular conditions continue after a power cy cle or ps pin reset, ocp may engage repeatedly, causing the ic to generate heat or otherwise suffer damage. if the inductance of the ic?s input/output wiring is large (e.g., due to long trace length), overload current may flow into the wiring before ocp engages, causing a jump in voltage on the input/output pin that may exceed the ic?s absolute maximum rating and damage the ic. additionally, if the ic conducts a current through the output that is larger than the specified output current rating but lower than the ocp threshold, the ic may heat up beyond its maximum rating (t jmax = 150c) and destroy itsel f. therefore, ensure that the set output current does not exceeds the ic?s maximum output rating.
technical note 5/8 BD63801EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. under-voltage lockout (uvlo) this ic features an integrated under-volta ge lockout function to prevent against output when powered by an insufficient supply voltage. if the supply voltage connected to the vc c terminal drops below 15 v (typ.), the motor output is forced open. this switching voltage threshold has a hysteres is of 1 v (typ.) to prevent malfunction due to noise on the input. this circuit does not function in power-save mode. also, when driving the ic in serial (clk-in) mode, the output angle is reinitialized to the default angle upon releas e of the uvlo circuitry. over-voltage lockout (ovlo) this ic features an integrated over-v oltage lockout function to prevent against output when powered by a supply voltage exceeding the rated input voltag e range. if the supply voltage connec ted to the vcc terminal reaches 32 v (typ.), the motor output is forced open. this switching voltage threshold has a hysteresis of 1 v (typ.) and a noise-masking period of 4 s (typ.) to prevent malfunction due to noise on the input. alt hough the ic features this integrated protection device, it may still be destroyed if the input voltage exceeds the ic?s absolute maximum ratings. this circuit does not operate in power-save mode. ghost supply prevention this ic features integrated ghost suppl y protection circuitry, which prevents the ic from being powered by a logic input when the power supply is disconnected or grounded. this circuitry prevents current from flowing through the integrated esd protection diodes (located be tween logic input pins and the vcc pin) , ensuring that the ic itself or any other peripherals connected to the vcc pin cannot be powered by an input signal on any logic terminals. therefore, the circuit will not malfunction if a logic signal is input to the ic while the power supply is disconnected or grounded. power dissipation htssop-b24 package the htssop-b24 package features a heat-radiating metal sl ag mounted on the backside of t he ic. ensure that the pcb design incorporates large areas of copper to facilitate heat dissipation as much as possible. as the heat slag is shorted with the substrate of the ic die, ensure that the slag is connected to gnd. c onnecting the slag to a potential other than gnd will cause the chip to ma lfunction. also ensure that the backside of the chip is completely and firmly soldered onto the pcb. the ratings specified in this sheet assume the ic has been properly mounted and soldered, and that the pcb has been adequately desi gned to facilitate heat dissipation. 3.0 2.0 1.0 100 125 4.0w 0 4 power dissipation : pd[w] 4.0 measurement machine th156 kuwano electric measurement condition rohm board board size 70*70*1.6mm 3 (with through holes on the board) the exposed metal of the backside is connected to the board with solder. board ? 1-layer board(copper foil on the back 0mm 2 ) board ? 2-layer board(copper foil on the back 15*15mm 2 ) board ? 2-layer board(copper foil on the back 70*70mm 2 ) board ? 4-layer board(copper foil on the back 70*70mm 2 ) board ? ja = 113.6 /w board ? ja = 73.5 /w board ? ja = 44.6 /w board ? ja = 31.3 /w fig.2 htssop-b24 derating curve 2.8w 1.7w 1.1w 3 2 1
technical note 6/8 BD63801EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. operation notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values ar e expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. (2) power supply polarity connecting the power supply with a reverse polarity can damage ic. take precautions when connecting the power supply lines. an external diode can be co nnected to the input for extra protection. (3) power supply lines pcb design should allow for low-impedance gnd and supply lines . to minimize noise on these lines, the gnd section and supply lines of the digital and analog blocks should be rout ed separately on the pcb. furthermore, for all power ic supply terminals, a capacitor should be connected between t he power supply and gnd terminal. if using electrolytic capacitors, note that their capacitance val ues may be reduced at lower temperatures. (4) gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any ti me, regardless of transient characteristics. (5) backside heat slag the metal heat slag integrated on the backside of the ic is c onnected internally with the backside of the ic die. therefore, it should always be connected to gnd. connecting to any other potential may cause malfunction or destruction of the ic. (6) thermal design use a thermal design that allows for a sufficient margin for the package?s rated power dissipation (pd) under actual operating conditions. keep in mind that t he packaging of this ic series has been designed with an exposed heat slag on the backside of the package, and that this heat slag should be soldered co mpletely to as broad a gnd pattern as possible (on both the base fin of the slag as well as the entire backsi de) to improve heat dissipation. (7) inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pi ns and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. (8) operation in strong electromagnetic fields using this product in strong electromagnet ic fields may cause ic malfunction. caut ion should be exercised in applications where strong electromagnetic fields may be present. (9) aso ? area of safe operation when using the ic, ensure that operating conditions do not exceed absolute maximum ratings or aso of the output transistors. (10) thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit, which is designed to force the motor output open if the ic?s internal temperature exceeds tjmax = 150c. it is not designed to protect the ic from damage or guarantee its operation. ics should not be used after this function has activated, or in applications where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hyst eresis temperature [c] (typ.) 175 25 (11) testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the eval uation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage.
technical note 7/8 BD63801EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. (12) input terminal of ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elem ents in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): ? when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode ? when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, a nd the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical dama ge. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig.3 example of monolithic ic structure (13) ground wiring patterns when using both small-signal and lar ge-current gnd traces, the two ground tr aces should be routed separately but connected to a single ground potential within the application in order to avoid variat ions in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. (14) test terminal connect the test pin to gnd during operation. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element
technical note 8/8 BD63801EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. ordering part number b d 6 3 8 0 1 ef v -e 2 ??` efv=htssop-b24 ??`?? e2: `???`? (unit : mm) htssop-b24 0.65 1.0max 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04 0.08 m s 0.08 1.0 0.2 0.53 0.15 0.17 +0.05 - 0.03 4 + 6 ? 4 s 24 13 112 0.325 (3.4) (5.0) 7.8 0.1 7.6 0.2 5.6 0.1 (max 8.15 include burr) 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
r1120 a www.rohm.com ? 2012 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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